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Re?ow Pro?le
Max. Ramp-up Rate = 3°C/S
260
240
220
T P
T L
Max. Ramp-down Rate = 6°C/S
t P
200
180
160
140
120
Tsmax
Tsmin
Preheat Area
t s
t L
100
80
60
40
20
0
120
240
360
Time 25°C to Peak
Time (seconds)
Pro?le Feature
Temperature Min. (Tsmin)
Temperature Max. (Tsmax)
Time (t S ) from (Tsmin to Tsmax)
Ramp-up Rate (t L to t P )
Liquidous Temperature (T L )
Time (t L ) Maintained Above (T L )
Peak Body Package Temperature
Time (t P ) within 5°C of 260°C
Ramp-down Rate (T P to T L )
Time 25°C to Peak Temperature
?2003 Fairchild Semiconductor Corporation
MCT9001 Rev. 1.0.7
8
Pb-Free Assembly Pro?le
150°C
200°C
60–120 seconds
3°C/second max.
217°C
60–150 seconds
260°C +0°C / –5°C
30 seconds
6°C/second max.
8 minutes max.
www.fairchildsemi.com
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